The hole diameter can be controlled by varying the annealing time or annealing temperature, offering a new means of manipulating hole morphology for possible applications as templates for nanostructure nucleation. Finally, in an initial approach, the integration of the combined droplet/thermal etching process with heteroepitaxy has been demonstrated. Selleck CP 868596 Acknowledgements The authors thank Stefano Sanguinetti for very helpfull discussions and the Deutsche Forschungsgemeinschaft for financial support via HA 2042/6-1 and GrK 1286. DEJ
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